AT307501B - Verfahren zur Herstellung einer integrierten Halbleitervorrichtung - Google Patents

Verfahren zur Herstellung einer integrierten Halbleitervorrichtung

Info

Publication number
AT307501B
AT307501B AT111768A AT111768A AT307501B AT 307501 B AT307501 B AT 307501B AT 111768 A AT111768 A AT 111768A AT 111768 A AT111768 A AT 111768A AT 307501 B AT307501 B AT 307501B
Authority
AT
Austria
Prior art keywords
manufacturing
semiconductor device
integrated semiconductor
integrated
semiconductor
Prior art date
Application number
AT111768A
Other languages
German (de)
English (en)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of AT307501B publication Critical patent/AT307501B/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/761PN junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0112Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs
    • H10D84/0114Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs the components including vertical BJTs and lateral BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/03Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/60Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
    • H10D84/63Combinations of vertical and lateral BJTs

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Bipolar Transistors (AREA)
  • Bipolar Integrated Circuits (AREA)
AT111768A 1967-02-07 1968-02-06 Verfahren zur Herstellung einer integrierten Halbleitervorrichtung AT307501B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR93983A FR1520514A (fr) 1967-02-07 1967-02-07 Procédé de fabrication de circuits intégrés comportant des transistors de types opposés

Publications (1)

Publication Number Publication Date
AT307501B true AT307501B (de) 1973-05-25

Family

ID=8624921

Family Applications (1)

Application Number Title Priority Date Filing Date
AT111768A AT307501B (de) 1967-02-07 1968-02-06 Verfahren zur Herstellung einer integrierten Halbleitervorrichtung

Country Status (9)

Country Link
US (1) US3576682A (en])
AT (1) AT307501B (en])
BE (1) BE710353A (en])
CH (1) CH483126A (en])
DE (1) DE1639355C3 (en])
FR (1) FR1520514A (en])
GB (1) GB1210981A (en])
NL (1) NL161618C (en])
SE (1) SE325962B (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL162511C (nl) * 1969-01-11 1980-05-16 Philips Nv Geintegreerde halfgeleiderschakeling met een laterale transistor en werkwijze voor het vervaardigen van de geintegreerde halfgeleiderschakeling.
JPS509635B1 (en]) * 1970-09-07 1975-04-14

Also Published As

Publication number Publication date
CH483126A (de) 1969-12-15
NL6801583A (en]) 1968-08-08
NL161618C (nl) 1980-02-15
DE1639355C3 (de) 1979-01-04
BE710353A (en]) 1968-08-05
US3576682A (en) 1971-04-27
DE1639355A1 (de) 1971-04-01
FR1520514A (fr) 1968-04-12
DE1639355B2 (de) 1978-05-03
SE325962B (en]) 1970-07-13
GB1210981A (en) 1970-11-04

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee